Materials Processing Laboratory

Contact: Barney E. Klamecki
ME 325B
Phone: (612) 625-0703
E-mail: klamecki@me.umn.edu

Materials Processing Laboratory
ME 50
Phone: (612) 625-8558

The Materials Processing Laboratory supports three types of activities:

• sensor, machine and software development aimed at closed-loop control of manufacturing processes;
• experimental work for study of the mechanics of manufacturing processes and verification of process models; and,
• material characterization.

Several projects involve closed-loop control of metal forming. A completely instrumented cup-drawing press with active control of binder and drawbead is operational. Industrial-scale pressbrake and rotary-draw tube bending machines have been modified with appropriate sensors and computer controls for closed-loop operation. The concepts embodied in these machines have been patented and are being commercialized.

Machining processes incorporating sensors located away from the cutting zone and in the tooling have been developed. Process state and tool condition can be monitored and are serving as a basis for process control. Turning and milling machines are being used in this work.

Reliability of a plasma cutting torch is being investigated using newly developed sensing techniques. We are concentrating on determining the factors responsible for deterioration of cutting torch performance due to cathode erosion. High speed observation of the cathode during operation is used to determine the extent of the cathode material melting, and emission from the surface is used to measure the cathode temperature during the various stages of the cutting process.

An MTS load frame (100 kN) with a temperature and humidity-controlled environmental chamber is available for material characterization at extreme conditions. Tests may be conducted at temperatures ranging from -130^o C to 315^o C. The equipment has been recently upgraded to allow low-force testing (200 lb and less) and fatigue testing.

Instrumentation facilitates metrology activity. Included are:

• an HP 5528A laser interferometer with a linear distance measurement resolution of 0.01 micron and velocity resolution of 0.1 mm/minute. The system is also capable of angular measurements at a resolution of 0.1 arc-sec;
• a Brown & Sharpe MicroVal coordinate measurement machine with a part size measurement capability of 457 x 610 x 381 mm (x, y, z). It has a resolution of 0.001 mm with a linear accuracy of 0.006 mm and volumetric accuracy of 0.015 mm; and,
• a Universal Kelch tool measurement machine with a resolution of 20 microinch.

The lab is also used for instructional purposes. Computers, software and computer-controlled machine tools are used in the Computer-Assisted Product Realization Course.